Y. C. Hu

Theoretical prediction of the growth and surface structure of Pt and Ni nanoparticles

Xi-Jing Ning, H. Tang, Zheng-Zhe Lin, 2011 .

Controlling the microstructure from the gold-tin reaction

C. Kao, J. Tsai, C. W. Chang, 2005 .

Electromigration-induced failure in flip-chip solder joints

Chang-Da Tsai, Y. L. Lin, Y. H. Lin, 2005 .

Electromigration failure in flip chip solder joints due to rapid dissolution of copper

King-Ning Tu, Y. H. Lin, K. Tu, 2003 .

A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni

Chang-Da Tsai, C. Kao, J. Tsai, 2003 .