Yan Zhang
发表
Yan Zhang,
K. Jeppson,
Johan Liu,
2019,
Materials.
Teng Wang,
Johan Liu,
B. Carlberg,
2012,
Nanotechnology.
Johan Liu,
Yan Zhang,
Jing-yu Fan,
2011
.
Johan Liu,
M. Jakubowska,
A. Arazna,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
J. Liu,
Yan Zhang,
Jing-yu Fan,
2005,
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
Johan Liu,
Yan Zhang,
Jing-yu Fan,
2006,
Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..
Yan Zhang,
Shun Wang,
Jing-yu Fan,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Johan Liu,
Yan Zhang,
Jing-yu Fan,
2013,
2013 14th International Conference on Electronic Packaging Technology.
Yan Zhang,
Johan Liu,
Xiuzhen Lu,
2020
.
J. Liu,
M. Andréasson,
Yan Zhang,
2008,
2008 2nd Electronics System-Integration Technology Conference.
Johan Liu,
H. Yin,
Yong Zhang,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Johan Liu,
Haomin Wang,
Yan Zhang,
2014
.
Yan Zhang,
Dao-zeng Wang,
Jing-yu Fan,
2003
.
Hongbing Lu,
Johan Liu,
A. Balandin,
2019,
2D Materials.
M. Inoue,
Johan Liu,
Yan Zhang,
2011
.
Johan Liu,
Z. Cheng,
Yan Zhang,
2010
.
Johan Liu,
R. Larsson,
Yan Zhang,
2008
.
Yan Zhang,
Itsuo Watanabe,
Johan Liu,
2008
.
M. Inoue,
Johan Liu,
Sijia Jiang,
2009,
2009 59th Electronic Components and Technology Conference.
J. Liu,
Z. Cheng,
Yan Zhang,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
Yan Zhang,
Jing-yu Fan,
2009
.
Johan Liu,
R. Larsson,
Z. Cheng,
2006,
Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..
Johan Liu,
R. Larsson,
Yan Zhang,
2007
.
Johan Liu,
Yan Zhang,
Jing-yu Fan,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Johan Liu,
R. Larsson,
Yan Zhang,
2006,
2006 1st Electronic Systemintegration Technology Conference.
Johan Liu,
Yan Zhang,
Shun Wang,
2010,
3rd Electronics System Integration Technology Conference ESTC.
Johan Liu,
H. Yin,
Longwang Tan,
2019,
2019 IEEE 19th International Conference on Nanotechnology (IEEE-NANO).
Zhaonian Cheng,
Yan Zhang,
Xiuzhen Lu,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Johan Liu,
Shaochun Zhang,
Shirong Huang,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Johan Liu,
Yan Zhang,
Zhili Hu,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Johan Liu,
K. Janeczek,
Yan Zhang,
2011
.
Yifeng Fu,
J. Liu,
Yan Zhang,
2012,
18th International Workshop on THERMal INvestigation of ICs and Systems.
Zhaonian Cheng,
Yan Zhang,
Teng Wang,
2007,
2007 International Symposium on High Density packaging and Microsystem Integration.
Teng Wang,
J. Liu,
Z. Cheng,
2007,
2007 International Symposium on High Density packaging and Microsystem Integration.
Teng Wang,
J. Liu,
Z. Cheng,
2006,
2006 International Conference on Electronic Materials and Packaging.
J. Liu,
Yan Zhang,
Z. Mo,
2005,
Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
Yan Zhang,
Dao-zeng Wang,
Jing-yu Fan,
2009
.
Experimental study on electrical properties and stability of CNT bumps in high density interconnects
Johan Liu,
Yifeng Fu,
Ying Zhou,
2013,
2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013).
Johan Liu,
Yifeng Fu,
Yong Zhang,
2014,
2014 15th International Conference on Electronic Packaging Technology.
Teng Wang,
Johan Liu,
Z. Cheng,
2009
.
Teng Wang,
Yifeng Fu,
J. Liu,
2008,
2008 2nd Electronics System-Integration Technology Conference.
Teng Wang,
Yifeng Fu,
J. Liu,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
Johan Liu,
Xiuzhen Lu,
Qiaoran Zhang,
2018,
International Conference on Electronic Packaging Technology.
Q. Zhai,
Yulai Gao,
J. Liu,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
J. Liu,
R. Larsson,
Z. Cheng,
2005,
International Conference on Polymers and Adhesives in Microelectronics and Photonics.
Yan Zhang,
Jing-yu Fan,
Johan Liu,
2005,
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
Johan Liu,
Yifeng Fu,
Shirong Huang,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).