W. Laub

An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates

R. A. Fournelle, D. Shangguan, R. Fournelle, 1999 .

Microstructural Investigation of Sn‐Ag and Sn‐Ag Solder Joints*

R. A. Fournelle, D. Shangguan, R. Fournelle, 1997 .

Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure

R. A. Fournelle, D. Shangguan, R. Fournelle, 2000 .