Huiping Yu

发表

F. Qin, Tong An, Pei Chen, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Liang Tang, F. Qin, Pei Chen, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Fei Qin, Huiping Yu, Yanpeng Gong, 2021, Engineering Analysis with Boundary Elements.

Y. Gong, F. Qin, Huiping Yu, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

Y. Gong, F. Qin, Yanwei Dai, 2020, Journal of Electronic Materials.

Chenshuo Liu, Zhiwei Zhang, F. Qin, 2019, Modelling and Simulation in Materials Science and Engineering.

Zhiwei Zhang, F. Qin, Tong An, 2018, Japanese Journal of Applied Physics.

Daquan Yu, F. Qin, Huiping Yu, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).