Guojun Qi

Recrystallization of gold alloys for producing fine bonding wires

Sam Zhang, Guojun Qi, 1997 .

Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction

Zhong Chen, Zhong Chen, Min He, 2004 .

Zincating morphology of aluminum bond pad: its influence on quality of electroless nickel bumping

Guojun Qi, L. Fokkink, Lambertus G.J. Fokkink, 2002 .

Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization

Zhong Chen, Zhong Chen, Min He, 2004 .