E. Lajoinie

Post SiN Etching Cleaning During Copper and Low K Integration

P. Besson, C. Arvet, D. Louis, 2001 .

Copper-SilK integration in a 0.18 /spl mu/m double level metal interconnect

Yves Morand, Christian Arvet, T. Mourier, 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).

Resist removal process in dual damascene structure integrating Cu and SiLK® for 0.18 µm technology

C. Arvet, D. Louis, I. Berry, 2000 .

Challenge of ashing and cleaning on SiOC-H dielectric: characterization and main issues

P. Brun, D. Louis, M. Assous, 2002 .

Wet or plasma clean? Competing or complementary? A dual damascene study with Si-OC-H dielectric on copper wiring

Christian Arvet, M. Assous, P. Brun, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).