X. Gu

发表

Cu damascene interconnects with an organic low-k fluorocarbon dielectric deposited by microwave excited plasma enhanced CVD

T. Ohmi, S. Kuroki, S. Sugawa, 2011, 2011 IEEE International Interconnect Technology Conference.

Tribological Study of Brush Scrubbing in Post-Chemical Mechanical Planarization Cleaning in Non-porous Ultralow-k Dielectric/Cu Interconnects

T. Ohmi, S. Sugawa, A. Teramoto, 2011 .

Universal and Solution-Processable Precursor to Bismuth Chalcogenide Thermoelectrics

A. Majumdar, D. Milliron, R. Segalman, 2010 .

Au-Induced Directional Growth of Inkjet-Printed 6,13-Bis(triisopropylsilylethynyl) Pentacene

Hongbo Lu, Guobing Zhang, L. Qiu, 2015, Journal of Display Technology.

A novel metallic complex reaction etching for transition metal and magnetic material by low-temperature and damage-free neutral beam process for non-volatile MRAM device applications

S. Samukawa, X. Gu, T. Nozawa, 2014, 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers.

A new metallic complex reaction etching for transition metals by a low-temperature neutral beam process

S. Samukawa, X. Gu, T. Nozawa, 2014 .

Integration Process Development for Improved Compatibility with Organic Non-Porous Ultralow-k Dielectric Fluorocarbon on Advanced Cu Interconnects

T. Ohmi, S. Kuroki, S. Sugawa, 2012 .

Advanced Direct-Polishing Process Development of Non-Porous Ultralow-k Dielectric Fluorocarbon with Plasma Treatment on Cu Interconnects

T. Ohmi, S. Sugawa, A. Teramoto, 2012 .

Electrical Characteristics of Novel Non-porous Low-k Dielectric Fluorocarbon on Cu Interconnects for 22 nm Generation and Beyond

T. Ohmi, S. Kuroki, S. Sugawa, 2011 .

Tribological Effects of Brush Scrubbing in Post Chemical Mechanical Planarization Cleaning on Electrical Characteristics in Novel Non-porous Low-k Dielectric Fluorocarbon on Cu Interconnects

T. Ohmi, S. Sugawa, A. Teramoto, 2011 .

Film deposition and UV curing process impact on ultralow-k dielectric for high performance Cu interconnects

X. Gu, Hao Deng, Zheyuan Tong, 2017 .

Effect of Additives in Organic Acid Solutions for Post-CMP Cleaning on Polymer Low-k Fluorocarbon

T. Ohmi, A. Teramoto, Takashi Ito, 2009 .

Investigation on reliability improvement for next generation Cu/ULK interconnects

X. Gu, Hao Deng, Beichao Zhang, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Dip-Coating of Patterned Organic Semiconductor Films

X. Gu, Xianghua Wang, M. Yuan, 2015 .

Liquid Crystalline Orientation of Rod Blocks within Lamellar Nanostructures from Rod−Coil Diblock Copolymers

A. Hexemer, B. Olsen, R. Segalman, 2010 .

Corrosion Properties of Magnetron Sputtered Al-Mg Alloy Coatings on High-Speed Electro-Galvanizing Steel

Changsheng Liu, X. Gu, Y. Shan, 2009 .

Morphology and texture of high speed galvanized coatings on interstitial free steel sheet

Jing Liang, X. Gu, Chang-sheng Liu, 2011 .

Algorithms for Multiple Genome Rearrangement by Signed Reversals

Xun Gu, Shiquan Wu, Shiquan Wu, 2001, Pacific Symposium on Biocomputing.

Multiple Genome Rearrangement by Reversals

Xun Gu, Shiquan Wu, Shiquan Wu, 2001, Pacific Symposium on Biocomputing.

Preparation and Properties of TiN Thin Films by D.C. Reactive Magnetron Sputtering

X. Gu, Y. Shan, Y. Wang, 2009 .

End-Point Detection of Ta/TaN Chemical Mechanical Planarization via Forces Analysis

Tadahiro Ohmi, Akinobu Teramoto, Yun Zhuang, 2010 .

Cu Single Damascene Integration of an Organic Nonporous Ultralow- $k$ Fluorocarbon Dielectric Deposited by Microwave-Excited Plasma-Enhanced CVD

T. Ohmi, S. Kuroki, S. Sugawa, 2012, IEEE Transactions on Electron Devices.

In situ Observation of Grain Growth on Electroplated Cu Film by Electron Backscatter Diffraction

T. Ohmi, A. Teramoto, S. Tsurekawa, 2009 .