A. Shirotori

Cu damascene interconnects with an organic low-k fluorocarbon dielectric deposited by microwave excited plasma enhanced CVD

T. Ohmi, S. Kuroki, S. Sugawa, 2011, 2011 IEEE International Interconnect Technology Conference.

Electrical Characteristics of Novel Non-porous Low-k Dielectric Fluorocarbon on Cu Interconnects for 22 nm Generation and Beyond

T. Ohmi, S. Kuroki, S. Sugawa, 2011 .

Improved resolution with main chain scission resists for EUV lithography

G. Vandenberghe, Ashish Rathore, M. Hoshino, 2022, Advanced Lithography.

A novel main chain scission type photoresists for EUV lithography

G. Vandenberghe, A. Shirotori, M. Hoshino, 2020, Photomask Technology.

Development of main chain scission type photoresists for EUV lithography

G. Vandenberghe, A. Shirotori, M. Hoshino, 2019, Photomask Technology.