Z. P. Wang

Process capability study and thermal fatigue life prediction of ceramic BGA solder joints

D. J. Xie, Z. P. Wang, Z. P. Wang, 1998 .

Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121, pp. 179–185]

Wei Zhou, Z. P. Wang, X. Q. Shi, 2000 .

HIGHLY ACCELERATED SOLDER JOINT RELIABILITY TEST USING A THERMO-MECHANICAL DEFLECTION SYSTEM (TMDS)

Z. P. Wang, X. Q. Shi, H. L. J. Pang, 2000 .

PHOTOINDUCED LASER EFFECTS IN INDIUM NITRIDE FILM

Z. P. Wang, Wenzhong Shen, W. Shen, 2011 .

Interfacial fracture toughness test methodology for adhesive bonded joints

Xunqing Shi, Z. P. Wang, H.L.J. Pang, 2002 .

Transcriptome characterization of HPG axis from Chinese sea perch Lateolabrax maculatus.

Z. P. Wang, Y. Zhu, X. Chen, 2017, Journal of fish biology.