Junqiang Wang

发表

Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness

Qian Wang, Jian Cai, Junqiang Wang, 2017, Journal of Electronic Materials.

Degradation mechanisms in electrochromic devices based on sol-gel deposited thin films

John Bell, Douglas R. MacFarlane, Anthony T. Baker, 1995 .

Study on a Low Power and High Efficiency Micro Heater Used in μPCR Chip

Zewen Liu, Tao Deng, T. Deng, 2012 .