Dejun Wang

Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness

Qian Wang, Jian Cai, Junqiang Wang, 2017, Journal of Electronic Materials.

Low resistance Ti Ohmic contacts to 4H-SiC by reducing barrier heights without high temperature annealing

Mingchao Gao, Lingqi Huang, M. Gao, 2012 .