L.-J. Huang

Carrier mobility enhancement in strained Si-on-insulator fabricated by wafer bonding

H.-S.P. Wong, J.O. Chu, L.-J. Huang, 2001, 2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184).

Si and SiC layer transfer by high temperature hydrogen implantation and lower temperature layer splitting

Y.-L. Chao, Q.-Y. Tong, T.-H. Lee, 1998 .

A “smarter-cut” approach to low temperature silicon layer transfer

Y.-L. Chao, Q.-Y. Tong, Roland Scholz, 1998 .

Low temperature InP layer transfer

Q.-Y. Tong, Ulrich Gösele, L.-J. Huang, 1999 .