Scott Barrett

Solder joint reliability and characteristics of deformation and crack growth of Sn-Ag-Cu versus eutectic Sn-Pb on a WLP in a thermal cycling test

Peter Elenius, Deok-Hoon Kim, P. Elenius, 2002 .

Ultra CSP/sup TM/ Bump on Polymer structure

Hong Yang, Peter Elenius, Scott Barrett, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

Ultra CSP™—A Wafer Level Package

Peter Elenius, Thomas W. Goodman, Scott Barrett, 2000, ECTC 2000.

Solder joint reliability of a polymer reinforced wafer level package

Peter Elenius, Deok-Hoon Kim, Scott Barrett, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).