K. Jeevan

Prediction of temperature in silicon chip with non‐uniform power: a Lagrangian interpolation approach

Kankanhalli N. Seetharamu, Teck Joo Goh, G. A. Quadir, 2004 .

OPTIMIZATION OF PCB COMPONENT PLACEMENT USING GENETIC ALGORITHMS

Ghulam Abdul Quadir, K. N. Seetharamu, A. Parthiban, 2002 .

A day ahead price sensitive reactive power dispatch with minimum control

K. Jeevan, Abhishek Rajan, T. Malakar, 2016 .

PPTP: Pre-Post Terminal Propagation in modern fixed-outline soft module VLSI floorplanning design

V. Ganapathy, K. Jeevan, H. Ramiah, 2012, 2012 10th IEEE International Conference on Semiconductor Electronics (ICSE).

Thermal management of multichipmodule (MCM) using genetic algorithms

Ghulam Abdul Quadir, K. N. Seetharamu, K. Jeevan, 2003, TENCON 2003. Conference on Convergent Technologies for Asia-Pacific Region.

Thermal management of multi‐chip module and printed circuit board using FEM and genetic algorithms

Kankanhalli N. Seetharamu, Ishak Abdul Azid, G. A. Quadir, 2005 .