K.K. Park

Temperature Dependence of Quality Factor in MEMS Resonators

M. Agarwal, R. Melamud, T. Kenny, 2006, Journal of Microelectromechanical Systems.

Effect of mechanical strength and residual stress of dielectric capping layer on electromigration performance in Cu/low-k interconnects

K. Lee, J. Lee, N. Lee, 2004, IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004..

Temperature Dependence of Quality Factor in MEMS Resonators

T. Kenny, M. Hopcroft, R. Candler, 2008, 19th IEEE International Conference on Micro Electro Mechanical Systems.

Fabricating capacitive micromachined ultrasonic transducers with direct wafer-bonding and LOCOS technology

O. Oralkan, M. Kupnik, H.J. Lee, 2008, 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.

Effects of Mechanical Vibrations and Bias Voltage Noise on Phase Noise of MEMS Resonator Based Oscillators

B. Murmann, M. Agarwal, R. Melamud, 2006, 19th IEEE International Conference on Micro Electro Mechanical Systems.