D. Bol
发表
David Bol,
Matthew J. Turnquist,
Lauri Koskinen,
2014,
2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
D. Bol,
2009
.
D. Flandre,
D. Bol,
J.-D. Legat,
2009
.
David Bol,
Denis Flandre,
Guerric de Streel,
2015,
2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
D. Flandre,
D. Bol,
G. D. Streel,
2017
.
David Bol,
Jean-Didier Legat,
Jean-Jacques Quisquater,
2006,
IEEE 17th International Conference on Application-specific Systems, Architectures and Processors (ASAP'06).
David Bol,
Denis Flandre,
Numa Couniot,
2015,
IEEE Transactions on Circuits and Systems II: Express Briefs.
David Bol,
Jean-Didier Legat,
Philippe Manet,
2005
.
David Bol,
Julien De Vos,
Cédric Hocquet,
2011
.
D. Bol,
C. Frenkel,
M. Lefebvre,
2019,
ArXiv.
D. Flandre,
D. Bol,
R. Dekimpe,
2021,
IEEE Journal of Solid-State Circuits.
David Bol,
Cédric Hocquet,
François Botman,
2011
.
David Bol,
Jean-Didier Legat,
Charlotte Frenkel,
2019,
IEEE Trans. Biomed. Circuits Syst..
Bottom-Up and Top-Down Neural Processing Systems Design: Neuromorphic Intelligence as the Convergence of Natural and Artificial Intelligence
pdf
David Bol,
Giacomo Indiveri,
Charlotte Frenkel,
2021,
ArXiv.
David Bol,
Jean-Didier Legat,
Charlotte Frenkel,
2018,
IEEE Transactions on Biomedical Circuits and Systems.
David Bol,
Jean-Didier Legat,
Charlotte Frenkel,
2017,
2017 IEEE Biomedical Circuits and Systems Conference (BioCAS).
David Bol,
Jean-Didier Legat,
Angelo Kuti Lusala,
2013,
2013 IEEE Faible Tension Faible Consommation.
David Bol,
Adrian Kneip,
D. Bol,
2021,
IEEE Transactions on Circuits and Systems I: Regular Papers.
David Bol,
Jean-Didier Legat,
Charlotte Frenkel,
2019,
IEEE Transactions on Biomedical Circuits and Systems.
Assessing the embodied carbon footprint of IoT edge devices with a bottom-up life-cycle approach
pdf
David Bol,
Thibault Pirson,
D. Bol,
2021,
Journal of Cleaner Production.
G. Indiveri,
D. Bol,
C. Frenkel,
2021,
Proceedings of the IEEE.
David Bol,
Denis Flandre,
Pengcheng Xu,
2019,
Integr..
David Bol,
Rémi Dekimpe,
Martin Lefebvre,
2021,
2021 IEEE International Solid- State Circuits Conference (ISSCC).
D. Bol,
C. Frenkel,
M. Lefebvre,
2021,
Frontiers in Neuroscience.
David Bol,
Jean-Didier Legat,
Charlotte Frenkel,
2020,
2020 IEEE International Symposium on Circuits and Systems (ISCAS).
David Bol,
Jean-Didier Legat,
Giacomo Indiveri,
2017,
2017 IEEE International Symposium on Circuits and Systems (ISCAS).
David Bol,
Jean-Didier Legat,
Charlotte Frenkel,
2016,
2016 IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC).
David Bol,
Jean-Didier Legat,
Charlotte Frenkel,
2015,
2015 10th International Symposium on Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC).
J. Louveaux,
D. Bol,
Mathieu Xhonneux,
2023,
IEEE Open Journal of Circuits and Systems.
David Bol,
Denis Flandre,
Jean-Didier Legat,
2009,
ISLPED.
David Bol,
Cédric Hocquet,
François Durvaux,
2012,
CHES.
David Bol,
Julien De Vos,
Dennis Sylvester,
2015,
2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers.
David Bol,
Denis Flandre,
Johan Segers,
2018,
2018 Design, Automation & Test in Europe Conference & Exhibition (DATE).
David Bol,
Denis Flandre,
Jean-Didier Legat,
2013,
2013 IEEE Faible Tension Faible Consommation.
David Bol,
Denis Flandre,
Pengcheng Xu,
2019,
2019 IEEE International Solid- State Circuits Conference - (ISSCC).
David Bol,
François-Xavier Standaert,
Itamar Levi,
2020,
IEEE Transactions on Circuits and Systems I: Regular Papers.
J. Legat,
D. Bol,
C. Frenkel,
2018,
arXiv.org.
Alessandro Barenghi,
Israel Koren,
David Bol,
2011,
RFIDSec.
David Bol,
Jean-Didier Legat,
Charlotte Frenkel,
2019,
2019 IEEE International Symposium on Circuits and Systems (ISCAS).
D. Bol,
G. de Streel,
J-D Legat,
2012,
2012 IEEE Faible Tension Faible Consommation.
David Bol,
Denis Flandre,
Pengcheng Xu,
2019,
IEEE Journal of Solid-State Circuits.
D. Flandre,
D. Bol,
Pengcheng Xu,
2023,
IEEE Transactions on Circuits and Systems - II - Express Briefs.
David Bol,
D. Bol,
2012
.
D. Bol,
R. Dekimpe,
Thibault Pirson,
2023,
IEEE Internet of Things Journal.
David Bol,
Denis Flandre,
Pengcheng Xu,
2021,
IEEE Journal of Solid-State Circuits.
David Bol,
Denis Flandre,
Pengcheng Xu,
2018,
2018 28th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS).
David Bol,
Julien De Vos,
Denis Flandre,
2015,
ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC).
David Bol,
Jérôme Louveaux,
Mathieu Xhonneux,
2021,
2021 IEEE Workshop on Signal Processing Systems (SiPS).
David Bol,
Andreia Cathelin,
Charlotte Frenkel,
2017,
IEEE Journal of Solid-State Circuits.
D. Flandre,
D. Bol,
L. Van Brandt,
2022,
IEEE Transactions on Circuits and Systems I: Regular Papers.
D. Bol,
M. Lefebvre,
2022,
IEEE Transactions on Circuits and Systems I: Regular Papers.
D. Bol,
Marco Gonzalez,
2023,
Design, Automation and Test in Europe.
David Bol,
Rémi Dekimpe,
D. Bol,
2021,
IEEE Transactions on Circuits and Systems II: Express Briefs.
D. Bol,
R. Dekimpe,
Thibault Pirson,
2021,
2021 Symposium on VLSI Circuits.
D. Bol,
M. Lefebvre,
Adrian Kneip,
2023,
IEEE Journal of Solid-State Circuits.
D. Bol,
M. Lefebvre,
Adrian Kneip,
2022,
ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC).
D. Flandre,
J.-D. Legat,
D. Bol,
2008,
2008 IEEE International SOI Conference.
D. Bol,
C. Frenkel,
M. Lefebvre,
2021
.
David Bol,
Orion Afisiadis,
Mathieu Xhonneux,
2019,
IEEE Internet of Things Journal.