Shih-Wei Lee

A TSV-based heterogeneous integrated neural-signal recording device with microprobe array

Shang-Lin Wu, Ching-Te Chuang, Wei Hwang, 2014, Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA).

A Novel Sealing Redistribution Layer Approach for Through-Glass via Fabrication

Shih-Wei Lee, Kuan-Neng Chen, Geng-Ming Chang, 2017, IEEE Journal of the Electron Devices Society.

A TSV-Based Bio-Signal Package With $\mu$ -Probe Array

Shang-Lin Wu, Ching-Te Chuang, Wei Hwang, 2014, IEEE Electron Device Letters.

Electrical testing structure for stacking error measurement in 3D integration

Shih-Wei Lee, Kuan-Neng Chen, Shu-Chiao Kuo, 2016, 2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA).