Kiyeong Kim
发表
Joungho Kim,
Yunsaing Kim,
Hyunsuk Lee,
2015,
2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC).
Joungho Kim,
Jaemin Kim,
Jun So Pak,
2010,
IEEE Transactions on Advanced Packaging.
Antonio Ciccomancini Scogna,
Kiyeong Kim,
Hwan-Woo Shim,
2017,
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC).
Chulsoon Hwang,
Kiyeong Kim,
Hwan-Woo Shim,
2020,
IEEE Transactions on Electromagnetic Compatibility.
Chulsoon Hwang,
Jun So Pak,
Joungho Kim,
2011
.
Junho Lee,
Joungho Kim,
Heegon Kim,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Junho Lee,
Daewoong Kim,
Kiyeong Kim,
2015,
2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Rao Tummala,
Joungho Kim,
Venky Sundaram,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Antonio Ciccomancini Scogna,
Kiyeong Kim,
Dong-Sub Kim,
2016,
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
Joungho Kim,
Jun So Pak,
Kiyeong Kim,
2014
.
Chulsoon Hwang,
Joungho Kim,
Jun So Pak,
2012,
2012 IEEE International Symposium on Electromagnetic Compatibility.
Chulsoon Hwang,
Antonio Ciccomancini Scogna,
Kiyeong Kim,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Joungho Kim,
Jun Fan,
Changwook Yoon,
2016,
IEEE Electromagnetic Compatibility Magazine.
Joungho Kim,
Jonghyun Cho,
Kiyeong Kim,
2015,
2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Joungho Kim,
Jiseong Kim,
Chulsoon Hwang,
2011,
2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Junho Lee,
Joungho Kim,
Heegon Kim,
2011,
2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
Junho Lee,
Joungho Kim,
Jun So Pak,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Joungho Kim,
Heegon Kim,
Sumin Choi,
2012,
2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.
Junho Lee,
Joungho Kim,
Heegon Kim,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Xinxin Tian,
Bruce Archambeault,
Michael Cracraft,
2014,
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).
Joungho Kim,
Venky Sundaram,
Heegon Kim,
2014,
2014 International 3D Systems Integration Conference (3DIC).
Joungho Kim,
Chulsoon Hwang,
Heegon Kim,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Joungho Kim,
Rao Tummala,
Venky Sundaram,
2014,
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).
Joungho Kim,
Daniel H. Jung,
Heegon Kim,
2014,
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems.
Joungho Kim,
Daniel H. Jung,
Heegon Kim,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
David Pommerenke,
James L. Drewniak,
Liangqi Gui,
2015,
IEEE Transactions on Electromagnetic Compatibility.
Joungho Kim,
Heegon Kim,
Jun So Pak,
2012,
2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.