P.M. Raj

Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates

P. Viswanadham, I.R. Abothu, S. Bhattacharya, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

New paradigm in IC package interconnections by reworkable nano-interconnects

I.R. Abothu, R.R. Tummala, P.M. Raj, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Simultaneous switching noise suppression using hydrothermal barium titanate thin film capacitors

I.R. Abothu, S. Bhattacharya, D. Balaraman, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Processing and Dielectric Properties of Nanocomposite Thin Film “Supercapacitors” for High-Frequency Embedded Decoupling

I.R. Abothu, D. Balaraman, Lixi Wan, 2007, IEEE Transactions on Components and Packaging Technologies.

Metal–Polymer Composite Interconnections for Ultra Fine-Pitch Wafer Level Packaging

R. Tummala, P. Raj, A. Aggarwal, 2007, IEEE Transactions on Advanced Packaging.

Development of high-k embedded capacitors on printed wiring board using sol-gel and foil-transfer processes

I.R. Abothu, S. Bhattacharya, D. Balaraman, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Embedded decoupling capacitor performance in high speed circuits

I.R. Abothu, D. Balaraman, Lixi Wan, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Electrochemical Biosensors and Microfluidics in Organic System-on-Package Technology

R. Tummala, M. Iyer, Jin Liu, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.