S. Sitaraman
发表
P. Viswanadham,
I.R. Abothu,
S. Bhattacharya,
2005,
Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..
C.P. Wong,
H. Reichl,
R. Leutenbauer,
1999,
Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).
C.P. Wong,
M. Swaminathan,
M. Rotaru,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
C.P. Wong,
M. Swaminathan,
M. Rotaru,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
M. Damani,
R. Tummala,
S. Sitaraman,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).