C. Patel

Terabus: a chip-to-chip parallel optical interconnect

P. Chiniwalla, J. Rosner, D. Kucharski, 2005, 2005 IEEE LEOS Annual Meeting Conference Proceedings.

3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections

B. Dang, Sung K. Kang, B. Webb, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Characterization of stacked die using die-to-wafer integration for high yield and throughput

B. Dang, K. Sakuma, E. Sprogis, 2008, 2008 58th Electronic Components and Technology Conference.

A CMOS-compatible process for fabricating electrical through-vias in silicon

J. Knickerbocker, E. Sprogis, P. Andry, 2006, 56th Electronic Components and Technology Conference 2006.

50μm pitch Pb-free micro-bumps by C4NP technology

Bing Dang, Da-Yuan Shih, K. Ruhmer, 2008, 2008 58th Electronic Components and Technology Conference.

Novel First-Level Interconnect Techniques for Flip Chip on MEMS Devices

J. Sutanto, S. Anand, J. Muthuswamy, 2012, Journal of Microelectromechanical Systems.

High-efficiency 60 GHZ antenna fabricated using low-cost silicon micromachining techniques

B. Gaucher, U. Pfeiffer, J. Grzyb, 2007, 2007 IEEE Antennas and Propagation Society International Symposium.

Optimal implementation of sea of leads (SoL) compliant interconnect technology

H. Thacker, B. Dang, M. Bakir, 2004, Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).

Pb-free microjoints (50 /spl mu/m pitch) for the next generation microsystems: the fabrication, assembly and characterization

J. Knickerbocker, E. Sprogis, K. Lee, 2006, 56th Electronic Components and Technology Conference 2006.

Assembly, Characterization, and Reworkability of Pb-free Ultra-Fine Pitch C4s for System-on-Package

A. Sharma, B. Dang, K. Sakuma, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.