Wei Ren

Investigation of nonlinear behaviors of packaging materials and its application to a flip-chip package

Sheng Liu, Zhengfang Qian, Daqing Zou, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens

Sheng Liu, Zhengfang Qian, Minfu Lu, 1999 .

Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method

Sheng Liu, Minfu Lu, Daqing Zou, 1999 .

Processing mechanics for flip-chip assemblies

Sheng Liu, Zhengfang Qian, Daqing Zou, 1999 .

A unified multi-axial sub-micron fatigue tester with applications to electronic packaging materials

Sheng Liu, Minfu Lu, D. Shangguan, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

A study of the mixed-mode interfacial fracture toughness of adhesive joints using a multiaxial fatigue tester

Sheng Liu, Minfu Lu, Daqing Zou, 1999 .

A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys

Sheng Liu, Zhengfang Qian, W. Ren, 1999 .

Effect of cleaning and non-cleaning situations on the reliability of flip-chip packages

Sheng Liu, Daqing Zou, Jianjun Wang, 1999 .