D. Nguyen

Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology

J. Gill, C.-C. Yang, A. Carbone, 2004, Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).

A 45 nm CMOS node Cu/Low-k/ Ultra Low-k PECVD SiCOH (k=2.4) BEOL Technology

R. Augur, G. Biery, S. Arai, 2006, 2006 International Electron Devices Meeting.

A high performance liner for copper damascene interconnects

D. Klaus, H. Rathore, C. Cabral, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL

J. Gill, C.-C. Yang, A. Carbone, 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.