T. Shaw

Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology

J. Gill, C.-C. Yang, A. Carbone, 2004, Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).

Performance of ultrathin alternative diffusion barrier metals for next - Generation BEOL technologies, and their effects on reliability

T. Spooner, X. Zhang, G. Bonilla, 2014, IEEE International Interconnect Technology Conference.

Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL

J. Gill, C.-C. Yang, A. Carbone, 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.

Optimization of SiCOH dielectrics for integration in a 90nm CMOS technology

N. Klymko, K. Ida, A. Grill, 2004, Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).

Chip Package Interaction for 65nm CMOS Technology with C4 Interconnections

D. Questad, J. Muncy, C. Carey, 2007, 2007 IEEE International Interconnect Technology Conferencee.

Chip-to-package interaction for a 90 nm Cu / PECVD low-k technology

C.-C. Yang, A. Cowley, D. Questad, 2004, Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).