Y. B. Tian

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

Jian Xiu Su, Zhuji Jin, Renke Kang, 2004 .

Numerical study on flow characteristics and impact erosion in ultrasonic assisted waterjet machining

Chuanzhen Huang, Hongtao Zhu, Rongguo Hou, 2018, The International Journal of Advanced Manufacturing Technology.

Investigation of the pulsed waterjet flow field inside and outside of the nozzle excited by ultrasonic vibration

Tao Wang, Rongguo Hou, Y. B. Tian, 2018, The International Journal of Advanced Manufacturing Technology.

Investigation on flow field of ultrasonic-assisted abrasive waterjet using CFD with discrete phase model

Chuanzhen Huang, Hongtao Zhu, Rongguo Hou, 2018 .

Optimization of the chemical mechanical polishing process for optical silicon substrates

Zhaowei Zhong, Y. B. Tian, Z. Zhong, 2012 .

Development of fixed abrasive chemical mechanical polishing process for glass disk substrates

Zhaowei Zhong, Y. B. Tian, Y. B. Tian, 2013 .

Comparative study on grinding of thin-walled and honeycomb-structured components with two CBN wheels

Zhaowei Zhong, R. Rawat, Y. B. Tian, 2015 .

Effects of chemical slurries on fixed abrasive chemical-mechanical polishing of optical silicon substrates

Zhaowei Zhong, Z. Zhong, Yebing Tian, 2013 .

Experimental investigation of cutting force, surface roughness and tool wear in high-speed dry milling of AISI 4340 steel

Li Li, Rufeng Xu, Xiang Cheng, 2019, Journal of Mechanical Science and Technology.

Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer

Jian Xiu Su, Zhuji Jin, Renke Kang, 2004 .