Kuo-Chuan Chen

The development of enhanced wafer level packaging

Shu-Ming Chang, Wei-Chung Lo, Li-Cheng Shen, 2002, 4th Electronics Packaging Technology Conference, 2002..

Investigation of electroplating Ni UBM for Pb-free solders

Shu-Ming Chang, Yu-Hua Chen, Hsun Hu, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..