S. C. Yang

Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element

C. Kao, C. W. Chang, C. E. Ho, 2007 .

Effects of limited cu supply on soldering reactions between SnAgCu and Ni

C. Kao, C. E. Ho, Y. W. Lin, 2006 .

Interfacial reaction issues for lead-free electronic solders

C. Kao, C. E. Ho, Chin-Roa Kao, 2006 .

Kinetics of AuSn4 migration in lead-free solders

C. Kao, C. W. Chang, C. E. Ho, 2006 .

Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu

C. Kao, C. W. Chang, C. E. Ho, 2006 .