Ken Miyairi

High density 3D silicon interposer technology development and electrical characterization for high end applications

Myriam Assous, Thierry Mourier, Jean Charbonnier, 2012, 2012 4th Electronic System-Integration Technology Conference.

Warpage control of silicon interposer for 2.5D package application

Myriam Assous, Kei Murayama, Mitsuhiro Aizawa, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Full Integration and Electrical Characterization of 3D Silicon Interposer Demonstrator Incorporating High Density TSVs and Interconnects

Myriam Assous, Kei Murayama, Mitsuhiro Aizawa, 2012 .

Electrical and morphological characterization for high integrated silicon interposer and technology transfer from 200 mm to 300mm wafer

Myriam Assous, Kei Murayama, Kenichi Mori, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.