M. Hossfeld

Description of the thermo-mechanical properties of a Sn-based solder alloy by a unified viscoplastic material model for Finite Element calculations

R. Metasch, X. Schuler, M. Roellig, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).