J.-P. Celis

Wafer-level thin film vacuum packages for MEMS using nanoporous anodic alumina membranes

C. Van Hoof, R. Puers, J. Zekry, 2011, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.

Characterization of interconnects resulting from capillary die-to-substrate self-assembly

C. Van Hoof, M. Mastrangeli, C. van Hoof, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Biofilms Inducing Ultra-low Friction on Titanium

W. Teughels, J. Celis, L. A. Rocha, 2010, Journal of dental research.