Miki Moriyama

Development of Ni/Al and Ni/Ti/Al ohmic contact materials for p-type 4H-SiC

Osamu Nakatsuka, Yasuo Koide, Masanori Murakami, 2003 .

Effect of Organic Additives on Formation and Growth Behavior of Micro-Void in Electroplating Copper Films

Susumu Tsukimoto, Masanori Murakami, Shinya Konishi, 2004 .

Electrical resistivity of polycrystalline Cu interconnects with nano-scale linewidth

Kazuhiro Ito, Masahiro Shimada, Susumu Tsukimoto, 2006 .

Development of Pt-based ohmic contact materials for p-type GaN

Yasuo Koide, Masanori Murakami, Y. Koide, 2001 .