Yi Lan Kang

发表

Identification of time-dependent interfacial mechanical properties of adhesive by hybrid/inverse method

Qing Hua Qin, Q. Qin, Y. Kang, 2008 .

Bump height effect on the reliability and on the strains variations of ACA flip-chip joints

Sheng Liu, Kuntjoro Pinardi, Zonghe Lai, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

A meshless model for transient heat conduction in functionally graded materials

Qing Hua Qin, Hui Wang, Q. Qin, 2006 .

Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip application

Magnus Willander, Sheng Liu, Dietmar Vogel, 2000 .

A study on the digital moire´ technique with circular and radial gratings

Xia Xiao, Wei Qiu, Qing-Hua Qin, 2007 .

Inverse/genetic method and its application in identification of mechanical parameters of interface in composite

Xue-Hui Lin, Qing-Hua Qin, Q. Qin, 2004 .

Experimental investigations of the effect of thickness on fracture toughness of metallic foils

Qing Hua Qin, Zhi-Feng Zhang, Y. Kang, 2005 .

The use of a carbon nanotube sensor for measuring strain by micro-Raman spectroscopy

Qing Hua Qin, Zhenkun Lei, Wei Qiu, 2013 .

Identification of interfacial parameters in a particle reinforced metal matrix composite Al6061-10%Al2O3 by hybrid method and genetic algorithm

Qing Hua Qin, Xue-Hui Lin, Q. Qin, 2005 .

Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip joints

Magnus Willander, Sheng Liu, Kuntjoro Pinardi, 2000 .

Size effect on the fracture toughness of metallic foil

Qing Hua Qin, Zhi-Feng Zhang, Y. Kang, 2003 .

A direct constraint‐Trefftz FEM for analysing elastic contact problems

Qing-Hua Qin, Y. Kang, Yi Lan Kang, 2005 .