Hengmao Liang

The Au/Si eutectic bonding compatibility with KOH etching for 3D devices fabrication

Dehui Xu, B. Xiong, Hengmao Liang, 2017 .

An out-of-plane electromagnetic induction based resonant MEMS magnetometer

Bin Xiong, B. Xiong, Hengmao Liang, 2019, Sensors and Actuators A: Physical.

In-Plane-Sense Magnetometer Based on Torsional MEMS With Vertically-Interlaced Combs via Self-Alignment Technique

B. Xiong, Hengmao Liang, Song Liu, 2020, IEEE Electron Device Letters.

An Electromagnetic Induction Based Torsional MEMS Magnetometer for In-Plane Magnetic Field Sensing

B. Xiong, Hengmao Liang, Song Liu, 2019, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII).

3D wafer level packaging technology based on the co-planar Au–Si bonding structure

B. Xiong, Hengmao Liang, Song Liu, 2019, Journal of Micromechanics and Microengineering.

Two-Mask Wafer-Level Vacuum Packaging With Bulk-Si 3D Interconnects for MEMS Devices and Its Package Performances

B. Xiong, Hengmao Liang, Xiao He, 2022, IEEE Sensors Journal.