Dao-Long Chen

Thermal resistance of side by side multi-chip package: Thermal mode analysis

Yi-Shao Lai, Dao-Long Chen, Tei-Chen Chen, 2015, Microelectron. Reliab..

A power and area efficient CMOS clock/data recovery circuit for high-speed serial interfaces

Dao-Long Chen, 1996 .

A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation

Yi-Shao Lai, Dao-Long Chen, Ping-Feng Yang, 2012, Microelectron. Reliab..

Compression Molding Mechanism and Parameter Evaluation of SiP

Dao-Long Chen, David Tarng, Ian Hu, 2020, 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

System Thermal Analysis of RF SiP Module in Smartphone

Cheng-Yu Tsai, Dao-Long Chen, David Tarng, 2020, 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption

Yi-Shao Lai, Ee-Hua Wong, Dao-Long Chen, 2015, Microelectron. Reliab..

An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer

Chang-Chi Lee, Li-Chieh Chen, Chin-Li Kao, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).