P. Dandu

Finite element modeling on electromigration of solder joints in wafer level packages

X. Fan, Y. Liu, Xuejun Fan, 2010, Microelectron. Reliab..

Novel α-amine-functionalized silica-based dispersions for selectively polishing polysilicon and Si(1 0 0) over silicon dioxide, silicon nitride or copper during chemical mechanical polishing

S. Babu, P. Dandu, N. K. Penta, 2010 .

Some remarks on finite element modeling of electromigration in solder joints

Y. Liu, X. Fan, P. Dandu, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Role of Different Additives on Silicon Dioxide Film Removal Rate during Chemical Mechanical Polishing Using Ceria-Based Dispersions

B. Peethala, S. Babu, Suryadevara V. Babu, 2010 .

Assessment of current density singularity in electromigration of solder bumps

Xuejun Fan, P. Dandu, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Role of amines and amino acids in enhancing the removal rates of undoped and P-doped polysilicon films during chemical mechanical polishing

B. Peethala, S. Babu, P. Dandu, 2010 .

Influence of adhesion of silica and ceria abrasive nanoparticles on Chemical–Mechanical Planarization of silica surfaces

I. Sokolov, P. Dandu, B. Santora, 2011 .

Reverse selectivity--high silicon nitride and low silicon dioxide removal rates using ceria abrasive-based dispersions.

S. Babu, P. Dandu, P. R. Veera Dandu, 2010, Journal of colloid and interface science.