Kyung-Moon Kim

Electromigration for advanced Cu interconnect and the challenges with reduced pitch bumps

N. Islam, Gwang Kim, Kyung-Moon Kim, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Laser Assisted Bonding (LAB) for Fine Pitch Cost Effective Interconnection

C. Scanlan, Choonheung Lee, Kyung-Moon Kim, 2020 .

Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for Low Cost and High Performance Flip Chip Package

Nokibul Islam, Vinayak Pandey, KyungOe Kim, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).