Myunghyun Ha

Transient Chip-Package Cosimulation of Multiscale Structures Using the Laguerre-FDTD Scheme

M. Swaminathan, Myunghyun Ha, K. Srinivasan, 2009, IEEE Transactions on Advanced Packaging.

Skin-Effect-Incorporated Transient Simulation Using the Laguerre-FDTD Scheme

M. Swaminathan, Z. Qian, A. Aydiner, 2013, IEEE Transactions on Microwave Theory and Techniques.

EM simulation using the Laguerre-FDTD scheme for multiscale 3-D interconnections

Myunghyun Ha, Myunghyun Ha, 2011 .