Ö. Vallin

发表

Two-Dimensional Flexible High Diffusive Spin Circuits.

M. Kamalakar, O. Karis, I. G. Serrano, 2018, Nano letters.

Adhension quantification methods for wafer bonding

Ulf Lindberg, Kerstin Jonsson, Örjan Vallin, 2005 .

Electrical properties of Ag/Ta and Ag/TaN thin-films

J. Olsson, D. Primetzhofer, S. Mardani, 2014 .

Morphological instability of Ag films caused by phase transition in the underlying Ta barrier layer

Shi-Li Zhang, J. Olsson, J. Wätjen, 2014 .

Strength of bonded interfaces

R. Knechtel, Ö. Vallin, K. Jonsson, 2020, Handbook of Silicon Based MEMS Materials and Technologies.

High thermoelectric power factor of p-type amorphous silicon thin films dispersed with ultrafine silicon nanocrystals

Shi-Li Zhang, Chenyu Wen, M. Venkata Kamalakar, 2020 .

High-temperature piezoresistive gauge fabricated on commercially available silicon-on-insulator wafers

Y. Bäcklund, Ö. Vallin, 2000 .

Ultralow magnetostrictive flexible ferromagnetic nanowires.

M. Kamalakar, P. Jönsson, I. G. Serrano, 2021, Nanoscale.

Dynamics of SiO2 Buried Layer Removal from Si-SiO2-Si and Si-SiO2-SiC Bonded Substrates by Annealing in Ar

J. Olsson, Ö. Vallin, S. Rubino, 2014, Journal of Electronic Materials.

Fabrication and Characterization of 150-mm Silicon-on-Polycrystalline Silicon Carbide Substrates

J. Olsson, S. Lotfi, H. Norström, 2012, Journal of Electronic Materials.

LDMOS-transistors on semi-insulating silicon-on-polycrystalline-silicon carbide substrates for improved RF and thermal properties

J. Olsson, S. Lotfi, L. Vestling, 2012 .

Elevated thermoelectric figure of merit of n-type amorphous silicon by efficient electrical doping process

Johan Liu, S. Majee, Shi-Li Zhang, 2018 .

Combined Bottom-Up and Top-Down Approach for Highly Ordered One-Dimensional Composite Nanostructures for Spin Insulatronics

M. Kamalakar, G. Barucca, D. Peddis, 2021, ACS applied materials & interfaces.