Luo Le

A wafer-level 3D packaging structure with Benzocyclobutene as a dielectric for multichip module fabrication

Geng Fei, D. Xiaoyun, Xu Gaowei, 2009 .

Electroplated indium bump arrays and the bonding reliability

L. Luo, Yuan Yuan, Gaowei Xu, 2010 .

Thermal analysis for multichip module using computational fluid dynamic simulation

Xu Gaowei, Luo Le, Chen Yingjun, 2004, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).

Fabrication of a microstrip patch antenna integrated in low-resistance silicon wafer using a BCB dielectric

Xu Gaowei, Luo Le, Han Mei, 2013 .

Preparation of Sn—Ag—In ternary solder bumps by electroplating in sequence and reliability

Yuan Yuan, Luo Le, Wang Dongliang, 2011 .

Joint shape, microstructure, and shear strength of lead-free solder joints with different component terminations

Luo Le, H. Weidong, Shawkret Ahat, 2002 .

The effects of cure temperature history on the stability of polyimide films

Luo Le, Zhu Chunsheng, Liping Heng, 2013 .

Wafer level hermetic packaging based on Cu–Sn isothermal solidification technology

Luo Le, Cao Yuhan, Luo Le, 2009 .

A new modulating electric field structure with homo-type fixed interface charges

Luo Le, Li Qi, Li Haiou, 2017, 2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM).