J. Leib

Novel Hermetic Wafer-Level-Packaging Technology using Low-Temperature Passivation

M. Topper, J. Leib, D. Mund, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Electronic transport in RuO2-based thick film resistors at low temperatures

V. Pavlík, C. J. Adkins, J. Leib, 1997 .

Electronic transport in RuO2-based thick film resistors at low temperatures

V. Pavlík, C. J. Adkins, J. Leib, 1997 .

NQR on Gallium Single Crystals for Absolute Thermometry at Very Low Temperatures

M. Huebner, J. Leib, G. Eska, 1999 .

A Hermetic Advanced Packaging Solution for Optical Devices Using a Glass-Capping Technology on Wafer-Level

M. Töpper, J. Leib, U. Hansen, 2009 .

Novel microstructuring technology for glass on silicon and glass-substrates

D. Mund, J. Leib, J. Leib, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Wafer Level Packaging Technology for Optical Imaging Sensors

H. Ngo, J. Leib, 2009 .

Conduction Mechanism in RuO2-Based Thick Films

M. Somora, J. Leib, Karol Flachbart, 1998 .