V. Lee

Development of 3D silicon module with TSV for system in packaging

V. Lee, Ho Soon We, Navas Khan, 2008, 2008 58th Electronic Components and Technology Conference.

Silicon Carbide Power Modules for High-Temperature Applications

V. Lee, M. J. Palmer, R. Johnson, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

SiC JFET Power Modules for Reliable 250°C Operation

R. Johnson, J. Scofield, D. Sheridan, 2012 .

Development of 3-D Silicon Module With TSV for System in Packaging

Xiaowu Zhang, V. Kripesh, N. Khan, 2010, IEEE Transactions on Components and Packaging Technologies.