R. Doraiswami

System-on-a-package (SOP) substrate and module with digital, RF and optical integration

M. Tentzeris, Fuhan Liu, V. Sundaram, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Hands-on module packaging education at Georgia Tech

Rao Tummala, Gary S. May, R. Doraiswami, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

A novel adaptive observer for very fast estimation of stator resistance in sensorless induction motor drives

Liuchen Chang, R. Doraiswami, H. M. Kojabadi, 2003, IEEE 34th Annual Conference on Power Electronics Specialist, 2003. PESC '03..

System-on-a-package (SOP) module development for a digital, RF and optical mixed signal integrated system

M. Tentzeris, V. Sundaram, D. Guidotti, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Isolation in mixed-signal systems using a novel electromagnetic bandgap (EBG) structure

Jinwoo Choi, Lixi Wan, M. Swaminathan, 2004, Electrical Performance of Electronic Packaging - 2004.

International collaboration in packaging education: hands-on system-on-package (SOP) graduate level courses at Indian Institute of Science and Georgia Tech PRC

R. Doraiswami, L. Conrad, N.J. Rao, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Novel board material technology for next-generation packaging

P. Markondeya Raj, R. Doraiswami, N. Kumbhat, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly

S. Bhattacharya, P. Markondeya Raj, R. Doraiswami, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).