X. Huo

Accurate modeling of lossy silicon substrate for on-chip inductors and transformers design

P.C.H. Chan, X. Huo, P. Chan, 2004, 2004 IEE Radio Frequency Integrated Circuits (RFIC) Systems. Digest of Papers.

RF circuit integration using high Q copper inductors on organic substrate and solder-bumped flip chip technology

P. Chan, X. Huo, Guo-Wei Xiao, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

High-performance microwave passive components on silicon substrate

Kevin J. Chen, P. Chan, L. Leung, 2002, 2002 3rd International Conference on Microwave and Millimeter Wave Technology, 2002. Proceedings. ICMMT 2002..

On-Chip Microwave Filters on Standard Silicon Substrate Incorporating a Low-k BCB Dielectric Layer

Kevin J. Chen, P. Chan, L. Leung, 2002, European Microwave Conference.

Silicon-on-Organic Integration of a 2.4–GHz VCO Using High-Q Copper Inductors and Solder-Bumped Flip Chip Technology

Kevin J. Chen, P. Chan, X. Huo, 2003, IEEE Transactions on Components and Packaging Technologies.

High-Q copper inductors on standard silicon substrate with a low-k BCB dielectric layer

P. Chan, X. Huo, K.J. Chen, 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).

Radio-frequency transmission properties of carbon nanotubes in a field-effect transistor configuration

M. Zhang, P. Chan, X. Huo, 2006, IEEE Electron Device Letters.

Radio-frequency characterization for the single-walled carbon nanotubes

Min Zhang, Philip C. H. Chan, Xiao Huo, 2006 .

Low‐loss microwave filters on CMOS‐grade standard silicon substrate with low‐k BCB dielectric

Kevin J. Chen, Philip C. H. Chan, L.L.W. Leung, 2004 .

A Physical Model for On-Chip Spiral Inductors With Accurate Substrate Modeling

K.J. Chen, P.C.H. Chan, H.C. Luong, 2006, IEEE Transactions on Electron Devices.