Woonghwan Ryu

Applications of a 3-D field solver for on-chip and package microstrip interconnection design

Joungho Kim, Woonghwan Ryu, A. Wai, 2000, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).

An efficient crosstalk parameter extraction method for high-speed interconnection lines

Joungho Kim, Woonghwan Ryu, Hyungsoo Kim, 2000, ECTC 2000.

Reduction of crosstalk noise in modular jack for high-speed differential signal interconnection

Woonghwan Ryu, Joungho Kim, Namhoon Kim, 2001 .

Over GHz low-power RF clock distribution for a multiprocessor digital system

Joungho Kim, Fan Wei, Woonghwan Ryu, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

Joungho Kim, Seungyoung Ahn, Woonghwan Ryu, 1999 .

Anisotropic conductive film (ACF) flip-chip interconnect in over GHz RF clock distribution system

Joungho Kim, Woonghwan Ryu, Kyung-Wook Paik, 2000, 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).