Fan Wei

Applications of a 3-D field solver for on-chip and package microstrip interconnection design

Joungho Kim, Woonghwan Ryu, A. Wai, 2000, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).

Micro- and nano-DIC deformation analysis for electronic packaging applications

J. Pang, Yaofeng Sun, Fan Wei, 2006, 2006 8th Electronics Packaging Technology Conference.

Over GHz low-power RF clock distribution for a multiprocessor digital system

Joungho Kim, Fan Wei, Woonghwan Ryu, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).