E. Klink

发表

Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- and multi-chip modules

E. Klink, A. Deutsch, G. Katopis, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

The evolution of build-up package technology and its design challenges

Jamil A. Wakil, Stefano Oggioni, Moises Cases, 2005, IBM J. Res. Dev..