Sanghak Lim

Effective Thermal Solution via Wafer Level Packaging Materials

Junghwa Kim, Wool-Chul Na, Jungseob Kim, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Soluble polycyclosilane–polysiloxane hybrid material and silicon thin film with optical properties at 193 nm and etch selectivity

Miyoung Kim, Seungbum Hong, S. J. Park, 2015 .

Tunable resin reactivity of spin-on dielectric by controlling synthesis process

Hyun-Ji Song, Miyoung Kim, Sang-Kyun Kim, 2012, Other Conferences.

Study of flowability effect on self-planarization performance at SOC materials

Sang-Hak Lim, Hui-Chan Yun, Jin-Hyung Kim, 2017, Advanced Lithography.