Sang-Kyun Kim

发表

Effective Thermal Solution via Wafer Level Packaging Materials

Junghwa Kim, Wool-Chul Na, Jungseob Kim, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Soluble polycyclosilane–polysiloxane hybrid material and silicon thin film with optical properties at 193 nm and etch selectivity

Miyoung Kim, Seungbum Hong, S. J. Park, 2015 .

The Effect of the physico-chemical properties of cellulosic polymers on the Si wafer polishing process

U. Paik, Jea‐Gun Park, Sang-Kyun Kim, 2006 .

Atomic force microscopy study of the role of molecular weight of poly(acrylic acid) in chemical mechanical planarization for shallow trench isolation

W. Sigmund, U. Paik, Jea‐Gun Park, 2006 .

Influence of Physical Characteristics of Ceria Particles on Polishing Rate of Chemical Mechanical Planarization for Shallow Trench Isolation

U. Paik, Jea‐Gun Park, P. Yoon, 2004 .

Ceria CMP Slurry for the Construction of Floating Gates in MLC NAND Flash Memory below 51 nm

U. Paik, Sang-Kyun Kim, Y. Kim, 2010 .

Increase in the Adsorption Density of Anionic Molecules on Ceria for Defect-Free STI CMP

U. Paik, Jea‐Gun Park, Sang-Kyun Kim, 2010 .

Effects of the Physical Characteristics of Cerium Oxide on Plasma-Enhanced Tetraethylorthosiliate Removal Rate of Chemical Mechanical Polishing for Shallow Trench Isolation

U. Paik, Seong-Geun Oh, Jea‐Gun Park, 2003 .

Influence of Crystalline Structure of Ceria on the Remaining Particles in the STI CMP

U. Paik, Jea‐Gun Park, Sang-Kyun Kim, 2007 .

Influence of the electrokinetic behaviors of abrasive ceria particles and the deposited plasma-enhanced tetraethylorthosilicate and chemically vapor deposited Si_3N_4 films in an aqueous medium on chemical mechanical planarization for shallow trench isolation

U. Paik, Sangkyu Lee, Jea‐Gun Park, 2003 .

A Reverse Selectivity Ceria Slurry for the Damascene Gate Chemical Mechanical Planarization Process

U. Paik, Jea‐Gun Park, Sang-Kyun Kim, 2004 .

Constraints of the Corning on Plugs of W Film in W Chemical Mechanical Planarization

D. K. Yi, U. Paik, Sang-Kyun Kim, 2009 .

Effect of calcination time on the physical properties of synthesized ceria particles for the shallow trench isolation chemical mechanical planarization process

U. Paik, Jea‐Gun Park, Sang-Kyun Kim, 2006 .

Large Area Encapsulation: Solid Type Epoxy Molding Compound

Junghwa Kim, Jungseob Kim, Donghwan Lee, 2018, 2018 International Wafer Level Packaging Conference (IWLPC).