C. Luo

发表

Novel Abrasion-Free CMP Technology with High Performance Polishing Slurry

C. Luo, Yuling Liu, 2020, 2020 China Semiconductor Technology International Conference (CSTIC).

Optimizing of the Colloidal Dispersity of Silica Nanoparticle Slurries for Chemical Mechanical Polishing

C. Luo, Yuling Liu, Wantang Wang, 2021, Silicon.

Role of 1,2-benzisothiazolin-3-one (BIT) in the Improvement of Barrier CMP Performance with Alkaline Slurry

Xinhuan Niu, Guorui Liu, C. Luo, 2019, ECS Journal of Solid State Science and Technology.

Synergist effect of potassium periodate and potassium persulfate on improving removal rate of Ruthenium during chemical mechanical polishing

Jianwei Zhou, C. Luo, Chenwei Wang, 2020, Materials Science and Engineering: B.

An optimized passivation mechanism at the copper film recess for achieving efficient planarization of copper chemical mechanical polishing

C. Luo, Yuling Liu, Wantang Wang, 2021, Materials Science in Semiconductor Processing.

Sisal fibre/polypropylene composites modified with carboxyl terminated hyperbranched polymer

Bin Huang, Shao-rong Lu, C. Luo, 2013 .

Roles and mechanistic analysis of adenine as a green inhibitor in chemical mechanical polishing

C. Luo, Yuling Liu, Wantang Wang, 2021, Journal of Applied Electrochemistry.

Synergy between dodecylbenzenesulfonic acid and isomeric alcohol polyoxyethylene ether for nano-scale scratch reduction in copper chemical mechanical polishing

C. Luo, Yuling Liu, Nengyuan Zeng, 2020 .

Study on enhancement and mechanism of K2SO4 in CMP slurries for copper film polishing removal effect

C. Luo, Yuling Liu, Nengyuan Zeng, 2023, Materials Science in Semiconductor Processing.

Optimizing of the Colloidal Dispersity of Silica Nanoparticle Slurries for Chemical Mechanical Polishing

C. Luo, Yuling Liu, Wantang Wang, 2021, Silicon.

Synthesis of Thermotropic Polyurethanes Containing Biphenylnate and Imide Units and their Mesophase Behavior

Dong-hui Guo, C. Luo, Zhixing Huang, 2011 .