Yuling Liu

发表

Novel Abrasion-Free CMP Technology with High Performance Polishing Slurry

C. Luo, Yuling Liu, 2020, 2020 China Semiconductor Technology International Conference (CSTIC).

Application of surfactant for facilitating benzotriazole removal and inhibiting copper corrosion during post-CMP cleaning

Xinhuan Niu, Yuling Liu, Chenwei Wang, 2018, Microelectronic Engineering.

Investigation of the barrier slurry with better defect performance and facilitating post-CMP cleaning

Xinhuan Niu, Yuling Liu, Baoguo Zhang, 2017 .

Effect of chelating agent on benzotriazole removal during post copper chemical mechanical polishing cleaning

Yuling Liu, Chenwei Wang, Shengli Wang, 2014 .

Chemical mechanical planarization of barrier layers by using a weakly alkaline slurry

Xinhuan Niu, Yuling Liu, Chenwei Wang, 2013 .

Optimizing of the Colloidal Dispersity of Silica Nanoparticle Slurries for Chemical Mechanical Polishing

C. Luo, Yuling Liu, Wantang Wang, 2021, Silicon.

Effect of Complexing Agent Choices on Dishing Control Level and the Shelf Life in Copper CMP Slurry

Yuling Liu, X. Luan, Chenwei Wang, 2018 .

Effect of a novel chelating agent on defect removal during post-CMP cleaning

Xinhuan Niu, Jiao Hong, Liying Han, 2016 .

Role of 1,2-benzisothiazolin-3-one (BIT) in the Improvement of Barrier CMP Performance with Alkaline Slurry

Xinhuan Niu, Guorui Liu, C. Luo, 2019, ECS Journal of Solid State Science and Technology.

Role of Dispersant Agent on Scratch Reduction during Copper Barrier Chemical Mechanical Planarization

Xinhuan Niu, Yanlei Li, Yuling Liu, 2018 .

Optimization of cleaning process parameters to remove abrasive particles in post-Cu CMP cleaning

Liu Yang, Yuling Liu, B. Tan, 2018, Journal of Semiconductors.

Study on the Weakly Alkaline Slurry of Copper Chemical Mechanical Planarization for GLSI

Xinhuan Niu, Shengjun Tian, Yuling Liu, 2017 .

Role of 1,2,4-Triazole in Co/Cu Removal Rate Selectivity and Galvanic Corrosion during Barrier CMP

Lina Han, Xinhuan Niu, Yuling Liu, 2017 .

The particle-size-controllable growth of silica sol abrasive for chemical mechanical polishing

S. Yao, Yuling Liu, Peng Gao, 2006, 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings.

Influence of surfactant on Si{111} etched surface

Xinhuan Niu, Yuling Liu, B. Tan, 2008, 2008 9th International Conference on Solid-State and Integrated-Circuit Technology.

Improvement of Barrier CMP Performance with Alkaline Slurry: Role of Ionic Strength

Xinhuan Niu, Yuling Liu, Kai Zhang, 2018 .

Stability of weakly alkaline barrier slurry with the high selectivity

Yuling Liu, X. Luan, Chenwei Wang, 2014 .

A study of FTIR and XPS analysis of alkaline‐based cleaning agent for removing Cu‐BTA residue on Cu wafer

Yuling Liu, Y. He, Chenwei Wang, 2019, Surface and Interface Analysis.

Studies on Electrochemical Characteristics of SiGe in Application to Chemical Mechanical Polishing

Yuling Liu, Baoguo Zhang, Chenwei Wang, 2018 .

An optimized passivation mechanism at the copper film recess for achieving efficient planarization of copper chemical mechanical polishing

C. Luo, Yuling Liu, Wantang Wang, 2021, Materials Science in Semiconductor Processing.

Roles and mechanistic analysis of adenine as a green inhibitor in chemical mechanical polishing

C. Luo, Yuling Liu, Wantang Wang, 2021, Journal of Applied Electrochemistry.

Corrosion control of copper wiring by barrier CMP slurry containing azole inhibitor: Combination of simulation and experiment

Guorui Liu, Yuling Liu, Nengyuan Zeng, 2020 .

Synergetic Effect of 5-Methyl-1H-Benzotriazole and Sodium Dodecyl Benzene Sulfonate on CMP Performance of Ruthenium Barrier Layer in KIO4-Based Slurry

Yuling Liu, B. Tan, Yi Xu, 2020 .

A novel compound cleaning solution for benzotriazole removal after copper CMP

Yuling Liu, Chenwei Wang, Baohong Gao, 2015 .

A Study of Cobalt Galvanic and Pitting Corrosion with Combination of BTA and PMP

Qiming Zhang, Yuling Liu, Baoguo Zhang, 2019, ECS Journal of Solid State Science and Technology.

Synergy between dodecylbenzenesulfonic acid and isomeric alcohol polyoxyethylene ether for nano-scale scratch reduction in copper chemical mechanical polishing

C. Luo, Yuling Liu, Nengyuan Zeng, 2020 .

Method of surface treatment on sapphire substrate

Yuling Liu, B. Tan, Liying Han, 2006 .

Study on enhancement and mechanism of K2SO4 in CMP slurries for copper film polishing removal effect

C. Luo, Yuling Liu, Nengyuan Zeng, 2023, Materials Science in Semiconductor Processing.

Optimizing of the Colloidal Dispersity of Silica Nanoparticle Slurries for Chemical Mechanical Polishing

C. Luo, Yuling Liu, Wantang Wang, 2021, Silicon.

Study on the cleaning of silicon after CMP in ULSI

Fang Wang, Yuling Liu, Kailiang Zhang, 2003 .

Effect of 1,2,4-triazole on galvanic corrosion between cobalt and copper in CMP based alkaline slurry

Lina Han, L. Fu, Yuling Liu, 2018 .

Synergistic Effect of Glycine and BTA on Step Height Reduction Efficiency after Copper CMP in Weakly Alkaline Slurry

Ping He, Chenwei Wang, Guofeng Pan, 2017 .

Electrochemical investigation of copper chemical mechanical planarization in alkaline slurry without an inhibitor

Yuling Liu, Y. Li, A. Wang, 2014 .

Effect of slurry components on chemical mechanical polishing of copper at low down pressure and a chemical kinetics model

Zhiwen Zhao, Baohong Gao, Yan Liang, 2011 .

Kinetics model incorporating both the chemical and mechanical effects on material removal for copper chemical mechanical polishing

Yan Liang, Yuling Liu, Baohong Gao, 2012 .

Effect of multi-functional amines on SiGe surface finish during chemical mechanical polishing

Yuling Liu, Baoguo Zhang, Ru Wang, 2019, Materials Science in Semiconductor Processing.

Effect of surfactant on removal of particle contamination on Si wafers in ULSI

Yuling Liu, B. Tan, X. Niu, 2006 .